• Final Surface Finish Selection
  
• Domestic Prototype to Off Shore Transition
  
• Compare the cost of Rigid Flex to PCB/Cable
  
• Flexible Circuit Stiffener Options
  
• Flex Circuit Coverlay Options
  
• Flex Circuit Cost Drivers
  
• ​Flex-to-Fit
  
• MCAD/ ECAD Collaboration
  
• Additive Process:  Fine Lines and Thin Copper
  
• Layout Databases
  
• Via hole filling options
  
• PCB Materials
  
• Micro Vias:  Critical Elements Simplified
  
• PWB Reliability and the IST Method
  
• PCB Fab Notes and The Quotation Package
  
• Rigid Flex
  

CONTACT US

tarad@omnipcb.com

507-332-9932

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Tara Dunn, President

Omni PCB and PCB Advisor

tarad@omnipcb.com ****  507-332-9932
 
As a recognized industry expert, I work with Designers, Engineers, Sourcing teams, Fabricators and users of Printed Circuit Boards to find best-fit solutions for their project challenges.  My network connects you to expertise to answer your questions and expand your knowledge!

If there is a topic that you need to know more about - or have information to share - lets connect!

PCB Coffee Talk: 

(Audio & Video Recordings)

Topics:

Flex and Rigid Flex

• Altium OnTrack - Getting a handle on flex cost drivers
  
• Something New For Everyone
  
• Challenges with Rigid Flex Design
  
• Structural Integrity and the Challenges of Rigid Flex PCB Design
• The Power of Flex
  
• Knowledge is Power:  Reduce Cost and Shorten Lead Time
  
• Troubleshooting Flex  Applications for Mil/Aero Projects
  
• Flex Circuit Cost Drivers
  
• Rigid Flex:  Total Cost Comparison
  
• When to use Rigid Flex
  
• Polyimide Coverlay and Adhesive Squeezeout
  
• Flex Circuit Shielding Options
  
• Flex Circuits:  The Basics
  
• Flex Material Handling:  An inside peek
  
• Cost Considerations for Flex Circuits
  

Additive Technology: Sub 1 mil line/space

• FlexFactor:  Advanced Manufacturing and Entrepreneurship
  
• Gold Traces used in Medical Applications
  
• Benefits of fine line additive process
  
• Circuitry on a balloon catheter
  
• Sub 1 Mil Line and Space
  

Design

• Five Tips Guaranteed to Reduce PCB Design Time
  
• 3D PCB Design: Why you need it and how it will help you​
  
• Designing Operational Amplifiers
  
• ​Efficient Heat Dissipation with SMD Heat Sinks
  
• Learning Current Density Don't Pop the Balloon
• IoT:  Let's Put the "A" Back in EDA
  
• Strategies for HDI Design
  
• HDI's Beneficial Influence on High Frequency Signal Integrity
  
• Flex-to-Fit
  
• Cap Plating of Filled Vias
  
• PCB Design Questions
  
• Micro Vias:  Just the basics
  
• Controlled Impedance:  The Basics
  
• The Evolution of Thermal Management in PCB's
  
• Thermal Management from a Fabrication Perspective
  
• Printed Circuit Board Panelization
  
• Top 5 PCB Design Guidelines every PCB Design Should Know
  
• PCB Design Guideline for Engineers - Part 1
  
• How to send the most complete documentation package - PCB Fab
  

RF / Microwave

• Finish Makes a Difference in Broadband Loss
  
• Signal Integrity Blog - Microwave Journal
  

Materials

• Copper Via-Fill Technology in Development
  
• Ormet Paste - Z-Axis connections during lamination
  
• Material Data Sheets:  The basics
  
• Zeta Materials
  

Surface Finish

• Mina:  Trouble free soldering to Aluminum
  
• Final Surface Finish:  How do you choose
  
• Selecting Final Surface Finishes
  
• ENEPIG Solderable Finish

Tips and Thoughts

• Customers:  Invited Guests to the Party
  
• 35 Years of HDI Fab Processes and Obstacles
  
• PCB Cost Drivers
  
• The Man Behind the Curtain:  Process Engineering
  
• A glimpse into PCB Sales
  
• IPC Flex and HDI Forum
  
• The Battelle NeuroLife Project
  
• Tips for Time Critical PCB's
  
• Domestic Prototype to Off Shore Production Transition
  
• "Is it just a Board"?
  
• IPC and MIL SPEC
  
• PCB Specialist or Generalist, just a thought
  
• Customer Service
  
• Buying printed circuit boards should not be difficult!
  
• PCB Sourcing Strategy:  Are you guilty?
  

ELECTRONICS CHEMISTRY

• Process Engineering Defect Prevention
• Video: Highlights of IPC's PCB Tech Trends 2016 Study
• Video: Electronics Chemical Reliability Fundamentals for IPC
• Chemical Surface Prep - The Art of Achieving Fine Lines & Spaces
• Source Electronics Chemistry by Application with RBPToolbox.com
• Non-Halide Fluxes Get the Job Done Right
• Feed and Bleed with NPS 3000
• Developing Fine Lines Continues to Challenge Board Manufacturers
• RBP Toolbox: Taking Technical Service to New Heights
• Ask Tony about Trapped Resist
• Ask Rob about Low Operating Costs
• Cleaning Innerlayers
• 5 Tips for Proper Antifoam Use
• Ask Rob about High Aspect Ratio Boards
• RBP Introduces New Oxide Alternative Adhesion Promoter​
  

Industry links

The Printed Circuit Board Designers Guide to:  (e- book download)

• Flex and Rigid Flex
  
• Design for Manufacturing
  
• AS9100 Certification
  
• Secrets to High Speed Design (part 1)
  
• Secrets to High Speed Design (part 2)
  
• Signal Integrity by Example
  
• The Rise of 5G - mmWave Moves Forward
  
• Power Integrity by Example
  
• Fundamentals of PF/Microwave PCBs

Organizations/Associations

• IPC
  
• ANSI = American National Standards Institute
  
• SMTA - Surface Mount Technology Association
  

Publications/ Industry Info

• PCB007
  
• PCB Update
  
• Electronic Engineering Times
  
• PCB Design Magazine
  
• The Microwave Journal 
  

Suppliers

• Dupont
  
• Isola
  
• Nelco
  
• Rogers
  
• Taconic
  
• Zeta Material
  
• Mac Dermid
  
• RBP Chemical
  

Software:

• Altium: 
  
• Cadence​
• Mentor Graphics
  
• Polar Instruments